data sheet 1 2001-01-01 description this gaas mmic mixer is intended for use in radio link applications. it provides a conversion loss of 9 db for a lo-power of 11 dbm and down conversion to 200 mhz. the device is fabricated with a 0.13 micron pseudomorphic ingaas/algaas/gaas high electron mobility transistor processing technology. 27 - 32 ghz gaas mixer mmic 27 - 32 ghz mixer preliminary data sheet ? monolithic microwave integrated circuit (mmic) single balanced mixer (coplanar design) input/output matched to 50 ? frequency range: 27 ghz to 32 ghz conversion loss 9 db @ p lo = 11 dbm chip size: 3.25 mm 2.0 mm esd : e lectro s tatic d ischarge sensitive device, observe handling precautions! type marking ordering code package 27 - 32 ghz mixer ? on request chip electrical specifications ( v g1 = v g2 = 0 v) parameter limit values unit test conditions min. typ. max. frequency range 27 ? 32 ghz ? conversion loss @ p lo = 11 dbm ?9 ? db? lo input power ? 10 15 dbm ?
gaas components 27 - 32 ghz mixer data sheet 2 2001-01-01 measured data (on chip measurements) v gs1 = v gs2 = 0 v, unless otherwise specified; down-converter mode; i f1 and i f2 via 0 combiner figure 1 0? if eht09220 if2 lo 90? 90? if1 rf
gaas components 27 - 32 ghz mixer data sheet 3 2001-01-01 conversion gain vs. lo power f lo = 29.5 ghz, f rf = 29.7 ghz, f if = 0.2 ghz, p inrf = 6.8 dbm technology data parameter value chip thickness 95 m chip size 3.25 mm 2.0 mm dc/rf bond pads 100 m 100 m/85 m 65 m bond pad material au (plated gold) chip passivation sin (silicon nitride) -15 -20.0 eht09221 conversion gain -17.5 -15.0 -12.5 -10.0 -7.5 -5.0 -2.5 0.0 db -10 -5 0 515 dbm lo input power
gaas components 27 - 32 ghz mixer data sheet 4 2001-01-01 recommendation of bonding conditions figure 2 bond plan v gs1 and v gs2 can directly be bonded to ground. blocking capacitors in the range of 100 pf should be used if a gate voltage ( v gs1 , v gs2 ) is applied to the mixer diodes. parameter thermocompression nailhead, without ultrasonic wedge bonding bond pull test mil 883, > 2 g table temp. 250 c 250 c 1 : 2.5 g tool temp. 180 c 150 c 2 : 3.1 g scrub 100 hz 3 : 3.2 g bond force 50 g 25 g 4 : 3.0 g wire diameter 25 m17 m 5 : 2.8 g eht09222 lo coplanar gnd coplanar gnd coplanar gnd coplanar gnd rf gs1 v v gs2 gnd gnd gnd gnd if1 if2
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